CEATEC JAPAN (日本電子展)

Duration 9/30 ~ 10/4 　　　　Hall No.: 5 Booth No.: 5C01

ELECTRONICA 2008 (慕尼黑電子展)

Duration 11/11~11/14　　　 HALL No.: B6 Booth No.: 261

1.RM─Thick Film Chip Resistors

　　 Miniature sign up to EIA 01005、with high densify & neliability.

2.CN─Thick Film Chip Networks

　　Integrated network for less PCB space、easy design and sowing SMT cost.

3.RB─Thin Film Chip resistors

　　 Thin-film technology for High precision、Low TCR、Low current noise.

4.UMS / MS ─ESD Suppressor

　　Ultra Low Capacitance MAX Guard ESD Suppressor with Ultra low capacitance 、Ultra low leakage current、Fast response time.

5.CF / CFS─Thin Film Chip Fuse

　　Thin-film technology for High precision、Low internal resistance、High surge stand ability.

6.RLM / RLN / RLP─Current Sensing Resistors

　　High power dissipation、Ultra low resistance(up to 1mΩ)、Exremely low TCR、UL-94V-0 grade over-coating.

7.NT─CHIP Thermistor

　　High precision、Low profile、High accuracy in resistance and B-constant.