2020

• Obtaining CQC certified by ETC
• Metal Foul Current Sensing Chip Resistor (RLM Series) pass AQP certified by DQS

2019

• Obtaining IECQ QC 080000:2017 certified by DQS
• Anti-Sulfurated Chip Resistor (RMS Series) is the world leaded Anti-Sulfurated product to pass AEC Q200 of AQP certification certified by DQS.

2018

• Obtaining ISO9001:2015 certified by DQS
• Updated TS-16949 to IATF-16949:2016 certified by DQS
• Anti-Sulfurated Chip Resistor (RMS Series) passed AQP certified by DQS
• Transfer investment to obtain a 100% equity in the exhibition of the original son of the exhibition, the total amount of the investment is NT$30,000.

2017

• Obtaining ISO14001:2015 certified by BV

2013

• Purchase NT$500 million in land to expanded facility area to able increased LED production capacity
• Issuance of the first unsecured conversion of corporate bonds in China, the amount of the issue is 562,500 yuan.

2012

• Attended Japan LED Nest Stage Exhibition in 2012
• Attended Germany Electronic Components Exhibition in 2012

2011

• Updated RBL(Low Ohm Chip Resistor) new specification
• Published Low-cost high-power LED molding technology
• Attended Display Optoelectronics Exhibition in 2011
• Obtaining the patent right for the formation method of the Ceramic radiating Substrate conductive jack.

2010

• Released LED Ceramic Metalized Substrate, and published the Process technology upgrade and as the result to accelerate product production efficiency.

2009

• MAX Guard EDS Suppressor passed IEC61000

2008

• Obtaining IECQ QC080000:2002 certified by (HSPM)UL
• Released MSA, UMSA MAX Guard EDS Suppressor, and RBL (Low Ohm Chip Resistor)

2007

• Invested in 49% equity of 大益電子廠(馬)股份有限公司

2006

• Obtaining TS-16949 certified by UL, Formally entered the international automobile industry.
• NTC Thermistor started to mass produce officially.

2005

• Released the new product such as 0402 Chip Fuse, NTC Thermisor, Anti-Sulfurated Chip Resistor, Thin Film Chip Resistor,ect. 
• Promoted TS-16949
• Obtaining OHSAS 18001:1999 certified by BV

2004

• Successfully developed 0603 Thin Film Chip Fuse, and passed safe certification certified by UL. Plan to release on market.

2003

• Trial for 0201 chip resistor accomplished.
• R&D photolithography and patterning equipment accomplished

2002

• TA-I Dongguan Plant in China established.
• First leaded to full introduction Lead-Free production and passed Sony GP(Green Partner) certification
• Full introduction of low temperature process

2001

• Stock listing approved by TWSE

2000

• Obtaining QS 9000 certified by UL
• TA-I Suzhou Plant in China established.

1999

• OTC stock listing and trading and Increased capital to NT$434.5 million

1997

• New product “High Voltage Chip Resistor” released

1996

• Obtaining I.E.C.Q certified by UL

1995

• Expanded the factory to 6F and increased capital to NT$109.2 million

1994

• Relocated to present address, and Increased capital to NT$52 million
• Started to produce the chip resistor arrays(networks)-convex type

1993

• Obtaining ISO-9002 certified by DNVI

1990

• Started to produce the resistor arrays

1989

Established TA-I Technology Co.,LTD was founded as a professional chip resistor manufacturer, and capital started with NT$37.5 million